Showing 17–32 of 36 results
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Epotek H70E-2
Good thermal conductivity, black in color, electrically insulative adhesive. Applications include glob top, chip SMT part protection, COB.
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Epotek H74
Thixotropic paste like adhesive with good thermal conductivity and electrically insulative. Cure is minimum 100 Deg C. Use cases such as die attach, heat dissipation, hermatic sealing in general.
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Epotek MED-198-54
Low Vvscoisty Biocompatible / Shadow cure Capable UV Epoxy ISO-10993 Tested and Certified for Medical Device Applications.
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Epotek MED-301
Biocompatible optically clear, room temp or mild heat cure and low viscosity. Cured at 65 Deg C for 1 hour material can meet ISO10993-4/-5/-6/-10/11 certifications. Max mix volume 25gm.
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Epotek MED-301-2
Biomedical compliant , optically clear , long pot life , room temp or mild heat cure. Cured at 45 DegC for 16 hours complies with ISO10993-4/5/6/10/11 certifications.
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Epotek MED-301-2FL
Optically clear , long port life flexible version of Epotek MED 301-2. Heat cure of 60 Deg C for 4 Hours passes ISO10993-5 test protocols .
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Epotek MED-302-3M
Excellent water , chemical and solvent resistance , acetone, up to 10% nitric Acid, Hexane and dichloromethane. Heat cure of 80 Deg C for 2 Hours passes ISO10993-5 test protocols .
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Epotek MED-353ND
High end reliable epoxy for sealing, bonding. heat cure at 150 DegC for 1 Hour adhesive passes ISO10993 -4/-5/-6,-10,-11 test protocols .
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Epotek MED-H20E
Electrical and thermally conductive adhesive. Bio compatibility based on heat cure at 150 DegC for 1 Hour adhesive passes ISO10993/-4/-5/-6,-10,-11 test protocols .
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EPOTEK MED-OG116-31
Biocompatible / Shadow cure Capable UV Epoxy ISO-10993 Tested and Certified for Medical Device Applications. Material is thixotropic , has high Tg and high chemical resistance.
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Epotek MED-T7110
General purpose adhesive with some thermal conductivity. Cure is 60 Deg for 4 hours, tested to ISO 10995-5 Certification.
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Epotek OG116-31
Single Component UV Curable Epoxy with medium viscosity designed for easy dispensing with no tailing. Post UV cure thermal post cure possible for shadow effects, High Tg offers high thermal and good chemical resistance. Applications are glob top, Optical bonding , LCD / LCOS sealing, Dam for dam and fill operations. Good adhesion to metals, … Continue reading Epotek OG116-31
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Epotek OG142-87
Is a single component UV curable low viscosity Epoxy with very high Tg. Has shadow cure capability with thermal post cure. Applications include optical bonding, shallow potting applications , lens bonding and medical sensors-devices. Requires 5-10 Deg C storage.
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Epotek OG198-54
Single Component UV Curable Epoxy , low viscosity. Has shadow cure capability with thermal post cure. This material also offers high Tg. Requires 5-10 Deg refrigeration for storage. Applications include optical, Semiconductor packaging, Sensor devices.
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Epotek OG198-55
Is a single component UV curable high viscosity Epoxy with very high Tg. Has shadow cure capability with thermal post cure. Applications include optical bonding, medical sensors-devices, Structural LED lighting applications. Requires 5-10 Deg C storage.
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Epotek OG603
Single component all purpose low viscosity high speed cure adhesive.