Showing 33–37 of 37 results
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Epotek P1011
Single Component polymide , high temperature silver filled, electrically conductive and thermally conductive adhesive. Applications for die attach, microelectronics packaging. Targets stencil printing applications and dispensing.
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Epotek P1011-ST
Single Component polymide, high temperature silver filled, electrically conductive and thermally conductive adhesive. Applications for die attach, microelectronics packaging.
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Epotek T7109
General purpose adhesive with thermal conductivity, electrically insulative. Cure is thermal only min 80 Deg C for 8 Hours. Applications are for potting , thermal management of electronics and semiconductors.
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Epotek T7110
General purpose adhesive with thermal conductivity, electrically insulative. Cure is thermal only min 80 Deg C for 8 Hours. Applications are for potting , thermal management of electronics and semiconductors.
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ResinDesigns Thermosink 35-6
Thermally conductive polymers protect sensitive components (such as integrated circuits) and can substantially improve product durability while reducing field failure rates.