Epotek ONBoard SolutionsEpotek ONBoard Solutions

Thixotropic paste like adhesive with good thermal conductivity and electrically insulative. Cure is minimum 100 Deg C. Use cases such as die attach, heat dissipation, hermatic sealing in general.

Thixotropic paste like adhesive with good thermal conductivity and electrically insulative. Cure is minimum 100 Deg C. Use cases such as die attach, heat dissipation, hermatic sealing in general.



Epotek H74

$0.00

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