Epotek EJ2189 Silver Filled RT Cure Epoxy Adhesive
- • Volume resistivity: ≤0.0005 Ω·cm
- • Perfect for EMI/RFI shielding
- • Room-temperature curing
Epotek EJ2189-LV Silver Filled RT Cure Epoxy Adhesive
- • Low viscosity, precision dispensing
- • Volume resistivity: ≤0.0005 Ω·cm
- • Ideal for micro-SMD bonding
Epotek EK2000 Silver Filled, Low Temperature Cure Epoxy Adhesive
- • Thermal conductivity: up to 35.5 W/mK
- • Great for die attachment
- • Low-temperature cure
Epotek H20E Electrically Conductive Epoxy Adhesive
- • NASA low-outgassing approved
- • Thermal conductivity: 29 W/mK
- • Ideal for space-grade applications
