Thermasolv DC2 is a dielectric heat transfer fluid from Inventec Performance Chemicals. It targets direct-to-chip cooling and delivers efficient two-phase performance.

Key Features of Thermasolv DC2

  • Boiling point 26°C / 79°F
  • Viscosity 0.4 cSt
  • Perfect for direct-to-chip cooling

What Is Thermasolv DC2 Used For?

Its main use is direct-to-chip cooling. In addition, it suits two-phase immersion systems and specialised manufacturing cooling.

How Does Thermasolv DC2 Deliver Two-Phase Cooling?

It stays liquid at ambient temperature, yet boils at just 26°C. As a result, it changes phase at hot chip surfaces. It then absorbs heat as it vaporises, with a heat of vaporisation of 163 J/g.

Efficient Flow

Low kinematic viscosity (0.4 cSt) and a pour point of -103°C support efficient system performance. In addition, very low surface tension (13 dynes/cm) and thermal conductivity of 0.086 W/m-K improve heat transfer.

Material Compatibility

It works with all metals and alloys, plus most plastics and elastomers. However, we recommend testing it with your materials before use. Furthermore, it stays thermally and chemically stable in use.

Why Choose Thermasolv DC2?

It is non-flammable, with no flash point, and free of EUH risk phrases and environmental hazard labelling. Also, it has an ultra-low GWP and zero ODP. Moreover, you can recycle used fluid through Inventec’s Ecoprogram. Therefore, it is a strong choice for high-density chip cooling.

Thermasolv DC2 Technical Specifications

Specification Value
Appearance Colorless, Clear
Purity >99.5%
Flash Point None
Boiling Point 26°C / 79°F
Pour Point -103°C / -153°F
Kinematic Viscosity 0.4 cSt
Liquid Density (@20°C) 1346 kg/m³
Surface Tension 13 dynes/cm
Vapor Pressure (@20°C) >70 kPa
Thermal Conductivity 0.086 W/m-K
Specific Heat Capacity (@20°C) 1210 J/kg-K
Heat of Vaporization 163 J/g
Dielectric Constant (@1kHz) Under evaluation
Ozone Depletion Potential (ODP) None
Global Warming Potential (GWP) Ultra-Low

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Thermasolv DC2

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Thermasolv DC2 is a dielectric heat transfer fluid designed for direct-to-chip cooling applications, remaining liquid at ambient temperature while delivering efficient two-phase cooling performance. With a boiling point of just 26°C, ultra-low GWP, and zero ODP, Thermasolv DC2 is non-flammable, non-toxic, and free of EUH risk phrases. Its exceptional surface tension and thermal stability make Thermasolv DC2 a safe, sustainable choice for high-performance chip cooling.

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