- Dielectric heat transfer fluid dedicated to direct-to-chip cooling applications
- Remains liquid at ambient temperature while delivering efficient two-phase cooling performance
- Colorless, clear liquid with >99.5% purity
- Non-flammable with no flash point, and free of any EUH risk phrases or environmental hazard labeling
- Ultra-low Global Warming Potential (GWP) and zero ozone depletion potential (ODP)
- Low pour point (-103°C/-153°F) and low kinematic viscosity (0.4 cSt) for efficient system performance
- Exceptional surface tension (13 dynes/cm²) supporting superior heat transfer efficiency
- Optimal thermal and chemical stability during use
- Compatible with all metals and alloys, plus most plastics and elastomers (pre-use testing recommended)
- Recyclable through the ECOPROGRAM service, supporting reuse and cost recovery
- Suitable for direct-to-chip cooling, two-phase immersion systems, and specialized manufacturing cooling applications
Technical Specifications
| Specification | Value |
|---|---|
| Appearance | Colorless, Clear |
| Purity | >99.5% |
| Flash Point | None |
| Boiling Point | 26°C / 79°F |
| Pour Point | -103°C / -153°F |
| Kinematic Viscosity | 0.4 cSt |
| Liquid Density (@20°C) | 1346 kg/m³ |
| Surface Tension | 13 dynes/cm² |
| Vapor Pressure (@20°C) | >70 kPa |
| Thermal Conductivity | 0.086 W/m-K |
| Specific Heat Capacity (@20°C) | 1210 J/kg-K |
| Heat of Vaporization | 163 J/g |
| Dielectric Constant (@1kHz) | Under evaluation |
| Ozone Depletion Potential (ODP) | None |
| Global Warming Potential (GWP) | Ultra-Low |
