Epotek H74 is an alumina-filled, two-part epoxy that conducts heat while insulating electrically. It is built to handle high thermal loads in power electronics. As a result, it keeps heat moving away from hot parts without any risk of short circuits.

Why choose Epotek H74?

Power components get hot, and poor heat transfer shortens their life. For this reason, H74 gives a stable path for heat between parts and heat sinks. At the same time, its insulating properties prevent electrical shorts.

It has a firm, rugged consistency that suits large bonds and potting. In addition, it cures below 120°C and passes NASA outgassing tests. It also bonds well to aluminium, copper and ceramics.

Once cured, it forms a moisture-resistant and chemically stable barrier. Therefore, it stands up to severe thermal shock and vibration over the life of the device.

Key features

• Alumina-filled, two-part epoxy
• Thermally conductive and electrically insulating
• Cures below 120°C
• Passes NASA outgassing tests
• Bonds to aluminium, copper and ceramics
• Resists thermal shock, vibration and moisture
• Available in 3 oz and 1 lb sizes

Where to use Epotek H74

This epoxy suits power electronics where heat and voltage are high. For example, it is a good fit for:

• Bonding large heat sinks
• Securing power transistors
• Potting high-voltage transformers
• Industrial and military-grade hardware

Tips for best results

First, clean and dry all surfaces before bonding. Next, mix both parts well until the colour is even. Then apply the epoxy and clamp parts in place. Finally, cure with heat as set out in the datasheet.

Need help choosing an adhesive?

OnBoard Solutions supplies Epotek adhesives to manufacturers across Australia. You can browse our thermally conductive adhesives or compare the long pot life Epotek H70E-2. To learn more about electronics assembly standards, visit the IPC website. Alternatively, contact our team to order Epotek H74 today.