NPM-GP/L Screen Printer

• High productivity through model changeover automation and production-time automation functions
• Real-time monitoring of equipment status optimizes maintenance timing
• Various functions for high-quality, stable printing responding to 5M changes
• Solder transfer and mask changer options for automated model switching
• APC-5M for optimized maintenance timing and expanded production time
• Variable angle attack squeegee and solder viscosity feedback for consistent print quality

The NPM-GP/L Screen Printer automates model changeover and other operations during production, while appropriately timed maintenance based on equipment condition monitoring contributes to increased production time. Various functions realise high quality printing and stable printing by responding to 5M changes, and M2M (Machine to Machine) communication with solder inspection equipment helps reduce defect losses.

For high productivity, the NPM-GP/L Screen Printer offers optional automation of model switching operations, including solder transfer (automatically collecting and feeding solder to the next model’s mask without losing solder shape), automatic replacement of bottom receiving pins, and a mask changer capable of stocking up to 10 masks. During production, optional automatic solder supply through a pot with hole, combined with a residual amount detection sensor, maintains the proper solder amount on the mask, while a paper-free wiping unit reduces cleaning paper and solvent use.

Equipment condition monitoring through the optional APC-5M system provides real-time visibility into unit status, optimizing maintenance timing and expanding available production time. For high printing quality, the NPM-GP/L Screen Printer supports a variable angle attack squeegee (45° to 70° in 1-degree increments, automatically adjustable via APC-FB volume function), a pre-bend high filling squeegee for improved filling performance, and materials matching to prevent setting errors across mask, squeegee, lower receiving block and solder.

Further printing quality functions include solder viscosity feedback, mask tension feedback, and solvent discharge feedback to maintain consistent process conditions. Printing condition optimization control (APC-5M) adjusts printing pressure, squeegee speed, and plate separation speed based on SPI results to maintain optimal printing volume, while APC-FB (Position) and APC-FB (Volume) automatically correct print position and volume based on SPI results.

Main Specifications