Series 53 Wire Bonder
- Complete, manual table-top bonder
- Unbeatable price-to-performance ratio
- Extremely adaptable bond settings, loop shapes, force and power profiles
- Dual wire clamp system for reproducible loops and tails
- Easy handling
- Six exchangeable bond heads available to suit different applications
The Series 53 Wire Bonder is a complete, manual table-top bonder designed to deliver an unbeatable price-to-performance ratio for development and low-to-medium volume bonding work. With extremely adaptable bond settings, loop shapes, force and power profiles, the Series 53 Wire Bonder gives operators precise control over the bonding process for a wide range of materials and geometries.
A dual wire clamp system ensures reproducible loops and tails, while the machine’s easy handling makes it well suited to both development environments and production settings that require flexibility. The Series 53 Wire Bonder supports six exchangeable bond heads, allowing a single platform to be configured for gold-ball bonding, thin wire wedge-wedge bonding, deep access bonding, heavy wire and heavy ribbon bonding, or manual die-bonding.
This modular approach means the Series 53 Wire Bonder can adapt as bonding requirements change, without the need to invest in a completely new machine. Each bond head is purpose-built for its application, with programmable axes and adjustable bond force to accommodate a broad range of wire, ribbon and die-bonding tasks.
Exchangeable Bond Heads
| Bond Head | Type | Key Specifications |
|---|---|---|
| 5310 | Gold-Ball | Wires 17.5–50 μm, standard capillaries 16–19mm, dual frequency US generator (60/100 kHz), bumping, safety-bump, stitch-on-ball, programmable Z-axis 60mm |
| 5330 | Thin Wire Wedge-Wedge | 1″ tools, aluminium/gold wires 17.5–75 μm, ribbon up to 250 x 25 μm, 45° wireguide (retrofitable to 30°/60°), dual frequency US generator, programmable Z-axis 60mm and Y-axis 25mm |
| 53XX BDA | Ball-Deep Access | Deep access wedge-wedge bonding with 1″ or ¾” tools, 90° wireguide, aluminium/gold wires 17.5–75 μm, gold-ball bonding 17.5–50 μm, suited to constricted geometries, programmable Z-axis 60mm and Y-axis 25mm, optional retrofit to 5380 die-bonder |
| 5350 | Heavy Wire | Aluminium wire 100–500 μm, copper wire 100–300 μm, wedge tool length 50–70mm, stitch or chain bonds of any length, clip-on wire guide, programmable Z-axis 60mm and Y-axis 25mm |
| 5350 HR | Heavy Ribbon | Aluminium ribbons up to 2mm width, programmable bond force up to 6,000 cN with force/power ramps, active ribbon guide, programmable Z-axis 60mm and Y-axis 25mm |
| 5380 | DIE-Bonder | Process-oriented for different die sizes, touchdown detection, programmable pickup and bond force, 2 x 2″ working area for waffle-, gel-packs or trays, bond/pickup force 5–500 cN programmable |
