The F&S BONDTEC Bond Pull LAB Tester LT-101 is a sophisticated, fully automatic desktop system designed for rigorous quality control in microelectronic assembly. Engineered for high-precision bond testing, this unit features a 40 x 40 mm work area with a 40 mm Z-stroke, accommodating total part sizes up to 200 x 150 mm on the XY stage. To ensure maximum versatility for various production requirements, the test head is vertically adjustable from 0 to 80 mm, allowing for the inspection of diverse component heights. The LT-101 utilizes a modular system with exchangeable test cartridges, making it equally capable of performing pull tests on both delicate thin wire and robust heavy wire interconnects. Its ergonomic design includes mobile user panels that provide operators with perfect adaptability for long-term use in laboratory or pilot production environments. By providing reliable, automated data on bond strength, the LT-101 ensures that your microelectronics manufacturing meets the strictest industrial standards for mechanical integrity and long-term reliability.