FS BONDTEC 5830 Thin-Wire Wedge-Wedge Bonder
- Thin-wire wedge-wedge version of the fully automatic Series 58xx wire bonders
- Exchangeable bond heads
- Fully automatic mode, ideally suited for medium-scale production
- Parts fed manually, bonds produced completely without operator influence
- Built-in pattern recognition for single bonds made within seconds
- Perfect for R&D, pilot manufacturing and middle volume production
The FS BONDTEC 5830 Thin-Wire Wedge-Wedge Bonder is the thin-wire version of the automatic wire bonders in the Series 58xx, featuring exchangeable bond heads. Its fully automatic mode makes the FS BONDTEC 5830 ideally suited for medium-scale production — parts to be bonded are fed manually by the operator, but the bonds themselves are produced completely without operator influence thanks to the built-in pattern recognition.
Single bonds can be made within seconds on the FS BONDTEC 5830, making the machine perfect for R&D, pilot manufacturing and middle volume production environments that need consistent, high-quality thin-wire bonds at speed.
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Aluminium and gold wire 17.5–75μm on 2″ spool |
| Bondhead | Wedge-Wedge for thin wire, standard tool of 1″ length, 45° wire feed, motorized wire spool (optional) |
| Ultrasonic System | F&S Generator 100kHz (optional 65, 140kHz) |
Bonder Base
| Attribute | Detail |
|---|---|
| Axes | Working area X/Y-axis 200 x 150mm, programmable step resolution 1μm, programmable Z-axis with 100mm stroke |
| Hardware | Dual-Core PC with Windows OS, Ethernet, USB 2.0/3.0, colour display 22″, GigE-CCD-Color camera (5 Mpixel), fully networkable in TCP/IP servers |
| Software | From single bonds up to complex programmes, loop shapes can be saved in libraries, optional pattern recognition |
| Control | High-performance embedded ARM-System with real-time operating system for precision, 1 wire/second |
| Placement accuracy | +/- 5μm @ 3 sigma, incl. tool / no wire on FS BONDTEC standard substrate |
| Repeatability | +/- 3μm @ 3 sigma, incl. tool / without wire on FS BONDTEC standard substrate |
| Loop height accuracy | +/- 5μm @ 3 sigma, for thin wire 5830 with 25μm aluminium wire on FS BONDTEC standard substrate |
| Dimensions | W x D x H – 92 x 71 x 65cm, weight approx. 80kg |
| Connections | 100–240 VAC, 1 Phase, 50/60Hz, max 230VA, Ø6mm standard vacuum tubing |
| Heater controller | Integrated in the machine, 0–250°C |
Workholder
| Type | Detail |
|---|---|
| Standard | Workholder for parts up to 8×6″ with vacuum and mechanical clamping |
| Optional – 6×6″ | 6×6″ workholder with vacuum and mechanical clamping |
| Optional – TO | TO workholder with mechanical clamping |
| Optional – Rubberized | 4×4″ workholder with rubberized surface and mechanical clamping |
