What Is the AUREL ALS200 CO2 Laser System?
The AUREL ALS200 is a reliable tool for ceramic processing in thin and thick film hybrid circuit production. It combines a stable RF-excited CO2 source on a granite frame with motorised focus. In addition, a double-nozzle head switches automatically between cutting and scribing.
What Are the Key Features of the AUREL ALS200?
Above all, the ALS200 is built for accurate, repeatable ceramic processing. Key features include:
- RF-excited, semi-sealed CO2 laser at 10.6 µm, rated 350 W with 850 W peak, and easy gas cartridge replacement
- Fixed head with a double nozzle, so it switches automatically between cutting and scribing
- Programmable pulse frequency and width, controlled in real time
- Motorised Z-axis focus to suit substrate thickness
- X-Y table running up to 500 mm/s with optical linear encoders, over a 300 x 300 mm work area
- High-resolution camera with cross-hair for substrate alignment, with automatic PRS vision available as an option
- PC control (Windows) with linear and circular interpolation, as well as recipe storage, data logging and safety interlocks
What Is the AUREL ALS200 Used For?
Because it can scribe, drill and cut, the ALS200 suits applications such as:
- Scribing of alumina (Al2O3) and aluminium nitride (AlN) substrates
- Drilling of ceramic substrates
- Cutting of ceramic substrates up to 2 mm thick (Al2O3)
- Thin and thick film hybrid circuit production
What Options Are Available for the AUREL ALS200?
In addition to the standard configuration, you can fit the ALS200 with the following options:
- PRS vision system for automatic alignment
- Stand-alone water chiller
- Exhaust aspiration and filtering
- Automatic loading and unloading from magazines (up to 6″ x 6″)
- Quick-lock work table holder
Why Choose the AUREL ALS200 for Ceramic Processing?
With a rated 350 W CO2 source reaching 850 W peak power and an X-Y table running up to 500 mm/s, this laser system is built for accurate, repeatable scribing, drilling and cutting of alumina and aluminium nitride substrates. It also switches automatically between cutting and scribing. As a result, with recipe storage and optional automatic handling, it suits both small-batch processing and higher-volume hybrid circuit production.
Technical Specifications
| Attribute | Detail |
|---|---|
| Laser type | Semi-sealed CO2, RF excitation |
| Wavelength | 10.6 µm |
| Rated / peak power | 350 W (CW) / 850 W |
| Work area | 300 x 300 mm |
| Substrate size (max) | 6″ x 6″ |
| X-Y speed (max) | Up to 500 mm/s |
| Thickness, Al2O3 (max) | Up to 2 mm |
| Cutting speed | 4 to 7 mm/s |
| Scribing speed | 100 to 200 mm/s |
| Dimensions (manual / with loader) | 980 x 2620 x 1800 mm / 1460 x 2620 x 1800 mm |
| Weight | 1500 kg / 1700 kg |
| Utilities | 230 V, 1-phase, 50 Hz; 6 bar, 150 Nl/min air; 60 mm exhaust |
