Viscom iS6052 3D AOI Inspection System is an automated optical inspection (AOI) system positioned by Viscom as its most economical AOI quality inspection solution, designed to provide reliable quality assurance for any kind of electronics production environment.

Viscom iS6052 3D AOI Inspection System Features

  • 3D sensor technology with XMe camera technology for detailed inspection
  • Four angled-view megapixel cameras plus an orthogonal camera with 12 µm resolution
  • Z-resolution of 0.5 µm and a Z-range of up to 30 mm
  • Inspection speeds of up to 60 cm²/s
  • Inspects solder joints, mounting, open surfaces, character recognition, solder paste, mold and assembly
  • Automatic width adjustment and pneumatic PCB clamping on a single-track transport system
  • SMEMA and Hermes interfaces for line integration
  • Runs on Windows with an Intel Core i7 processor

The Viscom iS6052 uses Viscom’s vVision user interface, with optional Viscom vSPC/SPC statistical process control (with an open interface), Viscom vVerify verification station, Viscom SRC remote diagnosis and Viscom PST34 programming station available to extend the system’s capabilities.

Applications

  • Solder joint and assembly quality inspection on electronics production lines
  • Solder paste inspection
  • Character recognition on populated boards
  • Mounting and open-surface defect detection
  • Mold inspection

With a field of view of 50 mm x 50 mm and support for PCBs up to 508 mm x 508 mm, the Viscom iS6052 is designed to fit into a range of electronics manufacturing lines, with optional PCB support and adjustable transport clearance to suit different board types.

Product Specifications

Attribute Detail
Inspection scope Solder joints, mounting, open surfaces, character recognition, solder paste, mold, assembly
Camera technology XMe
Z-resolution 0.5 µm
Z-range Up to 30 mm
Number of megapixel cameras (angled view) 4
Orthogonal camera resolution 12 µm
Field of view 50 mm x 50 mm (1.9″ x 1.9″)
Inspection speed Up to 60 cm²/s
User interface Viscom vVision
Operating system Windows
Processor Intel Core i7
PCB dimensions 508 mm x 508 mm (20″ x 20″)
PCB support Optional
Transport height 900–950 mm ± 20 mm (35.4″–37.4″ ± 0.7″)
Width adjustment Automatic
Transport concept Single-track transport system
PCB clamping Pneumatic
Upper transport clearance 50 mm (1.9″)
Lower transport clearance 50 mm (1.9″); 40 mm (1.5″) with PCB support
Positioning unit Synchronous linear motor
Interfaces SMEMA, Hermes
Power requirements 230/400 V, 50 Hz, 3P/N/PE ± 10%; 4–6 bar working pressure
System dimensions (W x D x H) 997 mm x 1756 mm x 1753 mm (39.2″ x 69.1″ x 69″)
Weight Approx. 820–920 kg (1807.7–2028.2 lbs)

Optional software modules for the Viscom iS6052, including vSPC/SPC, vVerify, SRC remote diagnosis and PST34 programming station, are available to suit different production line requirements.

Viscom iS6052 3D AOI Inspection System

In Stock

Viscom iS6052 3D AOI Inspection System is an automated optical inspection system designed for reliable quality assurance across electronics production environments. Using 3D sensor technology with four angled-view megapixel cameras plus an orthogonal camera, it inspects solder joints, mounting, open surfaces, character recognition, solder paste, mold and assembly, offering inspection speeds of up to 60 cm²/s.

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