The 5650 is a powerful heavy wire bondhead designed for the 56xx semi-automatic platform, catering to high-power electronics and automotive battery systems. This robust unit is capable of bonding aluminum wire from 100 to 500 µm and copper wire from 100 to 300 µm. To accommodate extreme package depths and large-scale components, it supports wedge tool lengths ranging from 50 to 70 mm. The 5650 head includes Deformation Limit Control (DLC) for rigorous real-time quality assurance and features a clip-on wire guide for rapid wire size exchange. Whether performing standard interconnects or complex stitch and chain bonds of any length, this head provides the massive ultrasonic energy and precision force control required for high-current industrial modules, ensuring long-term reliability in the most demanding thermal and mechanical environments.