Epotek ONBoard SolutionsEpotek ONBoard Solutions

This adhesive is electrically conductive and thermally conductive , silver filled. Cure is room temp and heat curable option.  Applications for EMI seals, RF shielding, ITO interconnects, LCD connects, cryogenic applications, die attach.Lower viscosity version of  Epotek EJ2189.    

This adhesive is electrically conductive and thermally conductive , silver filled. Cure is room temp and heat curable option.  Applications for EMI seals, RF shielding, ITO interconnects, LCD connects, cryogenic applications, die attach.Lower viscosity version of  Epotek EJ2189.

 

 



Epotek EJ2189-LV

$0.00

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