Wedge Bondhead 5330 BondtechWedge Bondhead 5330 Bondtech

Aluminum- and Goldwires from 17,5 to 75 μm
and ribbon up to 250 x 25 μm

Easy to Operate and erconomical use

  •  Wedge-Wedge-Bonding with 1“ Tools
  • 45° wireguide, retrofitable to 30° and 60° – according to component geometry
  • Dual frequency-US-generator for 60/100 kHz further Bondfrequencies available on request
  • Programmable Z-Axis 60 mm and Y-Axis 25 mm

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5330 Thin Wire Wedge Bonder

Aluminum- and Goldwires from 17,5 to 75 μm
and ribbon up to 250 x 25 μm