5330 Thin Wire Wedge Bonder
Aluminum- and Goldwires from 17,5 to 75 μm
and ribbon up to 250 x 25 μm
Easy to Operate and erconomical use
- Wedge-Wedge-Bonding with 1“ Tools
- 45° wireguide, retrofitable to 30° and 60° – according to component geometry
- Dual frequency-US-generator for 60/100 kHz further Bondfrequencies available on request
- Programmable Z-Axis 60 mm and Y-Axis 25 mm
Cart Information
5330 Thin Wire Wedge Bonder
Aluminum- and Goldwires from 17,5 to 75 μm
and ribbon up to 250 x 25 μm
