Viscom S 3088 SPIViscom S 3088 SPI

3D Solder Paste Inspection System

Reliable 3D SPI with Quality Uplink, process control and DualView

Extremely fast and precise inspection for high-volume production

  • Precise control of all essential 3D features; calibration-free
  • Extremely high throughput due to FastFlow Handling
  • Integrated height tracking
  • Viscom Quality Uplink: process optimisation and first-pass yield increase
  • Simple process analysis with the Viscom Uplink Analyzer
  • Fast program generation
  • Print optimisation through interlinkage with printer (closed loop)

 

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Viscom S3088 SPI

3D Solder Paste Inspection System

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