Viscom S3088 SPI
3D Solder Paste Inspection System
Reliable 3D SPI with Quality Uplink, process control and DualView
Extremely fast and precise inspection for high-volume production
- Precise control of all essential 3D features; calibration-free
- Extremely high throughput due to FastFlow Handling
- Integrated height tracking
- Viscom Quality Uplink: process optimisation and first-pass yield increase
- Simple process analysis with the Viscom Uplink Analyzer
- Fast program generation
- Print optimisation through interlinkage with printer (closed loop)