3D Solder Paste Inspection System

Extremely fast and paste deposition inspection 

  • Precise control of all essential 3D features; calibration-free , field proven high performance  5 Camera 3D-XM based Optical Technology.
  • Extremely high throughput
  • Integrated height tracking
  • Heights rendered up to 4mm possible for special materials application to PCBs
  • Viscom Quality Uplink: process optimisation and first-pass yield increase
  • Simple process analysis with the Viscom Uplink Analyzer
  • Fast program generation
  • Print optimisation through inter linkage with printer (closed loop) and to compatible SMT Equipment for Placement optimisation

Cart Information

Viscom S3088Ultra3DSPI


3D Solder Paste Inspection System