Extremely fast and paste deposition inspection

Precise control of all essential 3D features; calibration-free , field proven high performance 5 Camera 3D-XM based Optical Technology.
Extremely high throughput
Integrated height tracking
Heights rendered up to 4mm possible for special materials application to PCBs
Viscom Quality Uplink: process optimisation and first-pass yield increase
Simple process analysis with the Viscom Uplink Analyzer
Fast program generation
Print optimisation through inter linkage with printer (closed loop) and to compatible SMT Equipment for Placement optimisation

Viscom S3088Ultra3DSPI

$0.00

3D Solder Paste Inspection System

Category: Inspection

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