Viscom S3088Ultra3DSPI
3D Solder Paste Inspection System
Extremely fast and paste deposition inspection
- Precise control of all essential 3D features; calibration-free , field proven high performance 5 Camera 3D-XM based Optical Technology.
- Extremely high throughput
- Integrated height tracking
- Heights rendered up to 4mm possible for special materials application to PCBs
- Viscom Quality Uplink: process optimisation and first-pass yield increase
- Simple process analysis with the Viscom Uplink Analyzer
- Fast program generation
- Print optimisation through inter linkage with printer (closed loop) and to compatible SMT Equipment for Placement optimisation
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Viscom S3088Ultra3DSPI
3D Solder Paste Inspection System