Ultra Flexible DIE Bonder for most applications

Advanced Flexible Desk Die Bonder

The T-3002-PRO series is Tresky’s most flexible die bonding platform.

The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.
The PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

equiped with Tresky’s die ejector system for pick-up from wafer.

Application Packages:

  • Flip-Chip
  • Eutectic
  • Pick from Wafer
  • High Bondforce Force
  • Ultrasonic
  • Flip-Chip

Cart Information


T3002 PRO

Ultra Flexible DIE Bonder for most applications