Ultra Flexible DIE Bonder for most applications
Advanced Flexible Desk Die Bonder
The T-3002-PRO series is Tresky’s most flexible die bonding platform.
The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.
The PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.
equiped with Tresky’s die ejector system for pick-up from wafer.
- Pick from Wafer
- High Bondforce Force