For Power Electronics
Exceeding standard bonder capabilities
The sinter bonder fulfills the attachment requirements for power electronics from laboratory (batch processing) up to series production as fully automated inline systems.
The highly flexible bonder is equipped with sintering process specific components out of Infotech`s component matrix. Heated bond head with high force capabilities, substrate pre-heater and heater station with integrated force measurement, DTF feeder and more are part of the Infotech sinter bonder range.