Series 5832 Thin Wire Deep Access
Exchangeable Bondhead 5832
- >> Deep Access Wedge-Wedge bonding using 1″ or 3/4″ tools
- >> 90° wirde guide for aluminum and gold wirdes from 17.5 bis 75 µm
- >> Perfect for difficult and constricted bonding geometries
- >> Ideally suited for aluminum and gold ribbons
Series 5832 Thin Wire Deep Access
$0.00
Exchangeable Bondhead 5832
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