Series 5632 Thin Wire Deep Access
Exchangable Bondhead 5332
- Deep Access Wegde-Wedge bonding using 1″ or 3/4″ tools
- 90° wire guide for aluminum and gold wirdes from 17.5 bis 75 µm
- Perfect for difficult and constricted bonding geometries
- Ideally suited for aluminum and gold ribbons
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Series 5632 Thin Wire Deep Access
Exchangable Bondhead 5332
