Thin Wire Deep Access 5332 Bondtech ONBoard AustraliaThin Wire Deep Access 5332 Bondtech ONBoard Australia

Exchangable Bondhead 5332

  • Deep Access Wegde-Wedge bonding using 1″ or 3/4″ tools
  • 90° wire guide for aluminum and gold wirdes from 17.5 bis 75 µm
  • Perfect for difficult and constricted bonding geometries
  •  Ideally suited for aluminum and gold ribbons

 

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Series 5632 Thin Wire Deep Access

Exchangable Bondhead 5332