Series 5610 Gold Bonder
Exchangable Bondhead 5310
- Gold-Ball bonding for wires from 17,5 to 50 µm using stadard capillaries 16 mm to 19 mm
- Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
- Digital ultrasonic generator provides adjustable bond frequencies
- Bumping, safety-bump, stitch-on-ball
Series 5610 Gold Bonder
$0.00
Exchangable Bondhead 5310
Your Basket
You do not have any products in your selection basket.