5610 Bondheat Bondtech Australia ONBoard5610 Bondheat Bondtech Australia ONBoard

Exchangable Bondhead 5310

 

  •  Gold-Ball bonding for wires from 17,5 to 50 µm using stadard capillaries 16 mm to 19 mm
  • Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
  • Digital ultrasonic generator provides adjustable bond frequencies
  • Bumping, safety-bump, stitch-on-ball

 

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Series 5610 Gold Bonder

Exchangable Bondhead 5310