Rehm X-Line
Condensation & Vacuum In Line Soldering System
Inline condensation soldering with vacuum
The CondensoX-Line has brought a system to market that enables vacuum condensation soldering processes to be easily integrated into standard SMD lines. This allows void-free solder joints to be manufactured in a completely inert process environment (<100ppm O2), whether they are standard modules with BGA devices or DCB substrates for power electronics.
Unique technological advantages:
- Ideal for the processing of massive assemblies (IGBT, Heatsinks) down to sensitive sub-modules (01005, 03015)
- Reliable condensation soldering process for SMD manufacturing in a continuous process
- Horizontal transport of the modules of the entire process
- Inert process atmosphere during the entire soldering process for increased reliability of the assembly
- Cooling section can be used with <100ppm residual oxygen, ideal for subsequent bonding processes and surfaces to be protected against oxidation
- Void-free soldering with the use of vacuum for best results
- Significantly higher throughput when compared with stand-alone systems or batch systems, thanks to the multi-chamber structure
- Easy line integration
- Best traceability of soldering processes
Rehm X-Line
$0.00
Condensation & Vacuum In Line Soldering System
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