Contact Soldering

Reliable contact soldering – The Nexus makes it possible!

The Rehm Thermal Systems vacuum soldering oven is exceptionally well suited for production facilities which pursue flux-free and void-free soldering in various inert gases (N2, H2, N2/H2 95/5).

Unique technological advantages:

  • Oxide and void-free joint surface between chip and interconnected device
  • Integrated or separate cleaning and de-scaling processes
  • Simple profiling and fast heating and cooling rates
  • Assembly under high level of vacuum
  • Integration of drying and degassing processes
  • Optimum dispersal of waste heat


The vacuum soldering process generates temperatures of up to 450 °C and is an ideal solution for void-free and flux-free applications. Commonly used for bonding processes as well.

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Rehm Nexus

Contact Soldering