Low Voiding  solder paste with 20 – 38 micron Mesh size for ultra fine pitch printing

ECOREL FREE 305-16LVD is a no clean, lead-free solder paste developed with the reliable chemistry of the ECOREL range.

  • Ultra low voids percentage and reduced voids size in large contact area components
  • Very good wetting on any surface finish including OSP
  • Transparent and colorless residue even after multiple reflow cycles
  • Good first pass yield testability in ICT

ECOREL FREE 305-16LVD is able to achieve very low level of voiding especially for power components (QFN, DPAK, etc).

Unit Size - 500gr jar
Alloy - SAC 305
Melting Point - 217C

Ordering Size-
1 Jar

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Ecofree 305-16 LVD T4

Low Voiding  solder paste with 20 – 38 micron Mesh size for ultra fine pitch printing

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SKU: INV 33-227 Category: