Series 5810 Gold Bond Head
Exchangable Bondhead 5810
- Gold-Ball bonding for wires from 17,5 to 50 µm using standard capillaries 16 mm to 19 mm
- Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
- Digital ultrasonic generator provides adjustable bond frequencies
- Bumping, safety-bump, stitch-on-ball

Series 5810 Gold Bond Head
$0.00
Exchangable Bondhead 5810
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