Entry level DIE Bonder

Budget sensitive Manual Die Bonder

The T-4909 is a manual, high quality die bonder with superior ergonomic design. As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

Application Packages:

  • Epoxy
  • Eutectic
  • Ultrasonic
  • Flip-Chip

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T4909 Manual Bonder

Entry level DIE Bonder