Tresky T4909 Manual DIE Bonder – Economical Manual Die Bonder 

The Tresky T4909 Manual DIE Bonder is a manual, budget sensitive die bonder with
superior ergonomic design.
As with all of Tresky’s products, the T4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Bonding parameters and sequences are intuitively programmable by an integrated Raspberry PC with touchscreen.

Application Packages include:

• Epoxy
• Eutectic
• Ultrasonic
• Flip-Chip

Options:

Flip-Chip module beam splitter optics, which allows the simultaneous viewing
of two objects by an optical overlay (superposition) on the monitor.

Time/Pressure dispenser, stamping or preform spindle.

Technical Data:

XY- Movement (placement stage): 180mm x 180mm (manual)
Z- Movement: 95mm (manual)
Spindle Rotation: 360° (unlimited)
Bond Force: 20g – 1000g
Placement accuracy: ±10μm (operator/process depending)
Flip-Chip Placement accuracy: ±5μm Option (operator/process depending)
Connections: Compressed air 5 – 6 bar / Vacuum 0.6 bar (abs)
Dimensions: 755mm x 730mm x 500mm
Weight: 33kg
Voltage: 110V / 220V

View the full range of Die Bonders, here.

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