T4909 Manual Bonder
Entry level DIE Bonder
Budget sensitive Manual Die Bonder
The T-4909 is a manual, high quality die bonder with superior ergonomic design. As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.
Application Packages:
- Epoxy
- Eutectic
- Ultrasonic
- Flip-Chip