Manual Bonder with semi auto. process capabilities

The T-3000-PRO series is Tresky’s most flexible die bonding platform.

The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.

As with all of Tresky’s products, the T-3000-PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

Application Packages:

• Flip-Chip
• Eutectic
• High Bondforce Force
• Ultrasonic
• Flip-Chip