Tresky T-5100 DIE Bonder Component Placer – Manual Bonder with semi auto. process capabilities

The T-5100 is the universal workhorse for a wide range of micro-assembly tasks. The
manual operation makes it so very flexible and adaptable to many tasks in the R&D area,
and it is just as popular for small-scale and pilot production.

Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working with the machine.

The accuracy and repeatability of placing parts is superb. with features like a true, linear Z-Axis, Force Control, XY Fine Control and high-resolution optics that allow flip-chip placing down to sub-micron accuracy.
The extremely rigid machine base is compact and fits on a lab desk.

The T-5100-W version features up to a 200mm wafer table which sits below the main table with Tresky’s electronic die ejection system

Application Packages:

• Flip-Chip
• Eutectic
• High Bondforce Force
• Ultrasonic
• Flip-Chip