Ultra Flexible DIE Bonder with Semi-auto function

Manual Bonder with semi auto. process capabilities

The T-3000-PRO series is Tresky’s most flexible die bonding platform.

The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.

As with all of Tresky’s products, the T-3000-PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

Application Packages:

  • Flip-Chip
  • Eutectic
  • High Bondforce Force
  • Ultrasonic
  • Flip-Chip

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T3000 PRO

Ultra Flexible DIE Bonder with Semi-auto function