iX302Hybrid#1iX302Hybrid#1

The Hybrid combines high-accuracy Flip Chip bonding and SMT Placement

The Hybrid combines high-accuracy Flip Chip bonding directly from wafer with ultra-high-speed chip shooting.

  • Accuracy up to 7 µm CpK > 1.0
  • Ultra-low placement defect levels; below 1 dpm
  • Output up to 140 K
  • 0201m/008004 capability
  • Placing thin components without cracking
  • Full control of your process
  • Full traceability
  • Two systems available are Hybrid 3 (3 Feeder Trolley Positions) and Hybrid 5
    ( 5 Feeder Trolley Positions )
  • Direct Wafer Feeders are available

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iX-Hybrid Series Placement Systems

The Hybrid combines high-accuracy Flip Chip bonding and SMT Placement