FK Delvotec Wire Bonders
Welcome to our Wire Bonder category, featuring cutting-edge ultrasonic wire bonding solutions designed for precision and reliability across a variety of industries. Whether you are working in automotive, aerospace, medical, or power systems, our range of FK Delvotec wire bonders, including the M17S and M17D, offers advanced features and superior performance to meet the most demanding bonding applications.
The M17S and M17D are designed for high-precision wire bonding, offering exceptional versatility with dual bond heads, process monitoring, and flexibility to bond thin to thick wires as well as wire ribbons. With industry-leading technology such as Bond Process Control (BPC) and rapid reconfiguration capabilities, these bonders ensure high-quality, traceable bonds for critical applications.
Showing all 2 results
-
FK Delvotec M17D Fully Automatic Wire Bonder with Two Bond Heads
A dual-bond head, fully automatic wire bonder designed for high-precision, versatile bonding in automotive, power systems, and battery management.
-
FK Delvotec M17S Fully Automatic Ball-Wedge Wire Bonder
High-precision, fully automatic bonding for complex applications, ensuring superior bond quality and traceability.